May 17 - 20, 2018 - Beijing, China

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A First Look at CHITEC: An Extensive Showcase of “Chinese Chip” S&T Products  

Beijing - May 8, 2018 1:50:22 PM

The series of activities of 2018 “Meeting Beijing in the CHITEC” was launched yesterday. Zhang Yongming, Chairman of CCPIT Beijing, indicated that the general public in Beijing will be mobilized to come into the main venue of this year’s CHITEC, with the theme of “Take the Lead in Hi-tech Industries and Facilitate the Development of S&T Innovation Centers”. They will experience the cutting-edge technologies and industrial clusters of display areas such as Zhongguancun Science City, Beijing Economic-Technological Development Area and Huairou Science City, while personally appreciating the achievements of Beijing as the national Sci-Tech innovation center

The 21st China Beijing International High-Tech Expo will take place in Beijing from May 17 to May 20. Major activities of this year’s CHITEC include China Science and Technology Innovation Forum & Themed Talks, a 4-day exhibition, 12 promotion fairs and 10 forums. It is revealed that a large number of breakthrough achievements in cutting-edge and core & key technologies will be gathered and exhibited at this year’s CHITEC. Achievements of China’s independent innovation will be showcased, including the world’s smallest 32-wire laser radar and Y-20, code-named KunPeng, the new generation medium military large transport aircraft.

Moreover, a great deal of effort and attention is given to the promotion of major marine Sci-Tech achievements such as the SeaWing Underwater Glider, the Discovery 4500 Underwater Robot, Snow Dragon, Snow Eagle, Xiangyanghong 10, 10-Thousand-ton Coast Guard Ship, Blue Whale 1 and combustible ice mining, major innovation achievement projects and disruptive cutting-edge technologies of Zhongguancun in the most advanced industries such as artificial intelligence, big data and virtual reality. Cambrian 1A processor, Yangtze River Storage Technology (YMTC) 32-layer 3D NAND flash memory chip, UNISOC SC9850KH and key technology products in areas of cloud computing and intelligent chips will also be focused and exhibited to help build the “Chinese Chip”.

It is reported that Beijing-Tianjin-Hebei collaborative innovation will also be focused at this year’s CHITEC. Beijing-Tianjin-Hebei intelligent energy-conserving & low-carbon exhibition zone will showcase the innovative achievements in the areas of high-efficient energy-conservation, clean energy and resource recycling in the form of “Internet+ Energy-conserving & Low-carbon”.

For the first time, an area will be set up for military-civilian integration technology exhibition area at this year’s CHITEC, gathering a large number of military-local enterprises to exhibit military-local cooperative projects such as emergency rescue technical equipment, electronic communication equipment, aerospace technology application, engine research & development, face recognition technology and robotics so as to facilitate the opening up of military-civilian scientific and technological resources, as well as the mutual transfer of military-civilian dual-use technologies.

At present, various preparatory works of CHITEC have basically been completed, with more than 1600 enterprises to attend.